[UMC Announces Exchangeable Bond Pricing Taipei, Taiwan, R.O.C. – November 30, 2009 These bonds are the first two exchangeable bonds issued by a Taiwanese company since February 2008. UMC believes the pricing terms fully reflect its solid financial position and excellent credit record. This is consistent with UMC’s policy to dispose its non-core holdings in a non-disturbing manner. Going forward,] [Form 6-K November 30, 2009 United Microelectronics Corporation ——————————————————————————————————— No. 3 Li Hsin Road II ——————————————————————————————————— x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu Chief Financial Officer Description 99 UMC Announces Exchangeable Bond Pricing 6-K 1 htm_4541.htm LIVE FILING]

[Description 99.1 rd Announcement on 2009/10/28: The Board of Directors resolved to issue the 3 99.2 th Announcement on 2009/10/28: The Board of Directors resolved to issue the 4 99.3 Announcement on 2009/10/28: Board resoluted to acquire UMC Japan through Tender Offer 99.4 Announcement on 2009/10/28: UMC announced its unconsolidated operating results for the third quarter of 2009 99.5 Announcement] [Form 6-K November 19, 2009 United Microelectronics Corporation ——————————————————————————————————— No. 3 Li Hsin Road II ——————————————————————————————————— x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu Chief Financial Officer Description 99 6K on 11/19/2009 6-K 1 htm_4511.htm LIVE FILING]

[UNITED MICROELECTRONICS CORPORATION Address: No. 3 Li-Hsin Road II, Hsinchu Science Park, Hsinchu City, Taiwan, R.O.C. The reader is advised that these financial statements have been prepared originally in Chinese. In the event of a conflict between these financial statements and the original Chinese version or difference in interpretation between the two versions, the Chinese language financial statements shall prevail.] [Form 6-K November 6, 2009 United Microelectronics Corporation Hsinchu, Taiwan, R.O.C. No. 3 Li Hsin Road II þ o o o o þ n/a United Microelectronics Corporation Chitung Liu Chief Financial Officer Description 99.1 6-K 1 c91966e6vk.htm FORM 6-K]

[UMC proposed to acquire UMC Japan through Tender Offer Taipei, Taiwan, R.O.C. — October 28, 2009 UMCJ operates a semiconductor manufacturing plant in Tateyama City, Chiba, Japan with a monthly production capacity of 20,000 eight inch wafers. In January 1999, UMC acquired a majority interest in UMCJ (then known as NMBS Semiconductor), with the goal of utilizing UMCJ as a] [Form 6-K October 28, 2009 United Microelectronics Corporation ——————————————————————————————————— No. 3 Li Hsin Road II ——————————————————————————————————— x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu Chief Financial Officer Description 99 6K on 2009/10/28 6-K 1 htm_4440.htm LIVE FILING]

[Description 99.1 Announcement on 2009/09/21: To announce related materials on acquisition of machinery and equipment 99.2 Announcement on 2009/09/21: To announce related materials on acquisition of machinery and equipment 99.3 Announcement on 2009/10/01: To announce related materials on disposal of Real estate 99.4 Announcement on 2009/10/01: Amendment of the announcement on 2009/10/1:Related materials on disposal disposal of Real estate 99.5] [Form 6-K October 26, 2009 United Microelectronics Corporation ——————————————————————————————————— No. 3 Li Hsin Road II ——————————————————————————————————— x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu Chief Financial Officer Description 99 6K on 10/26/2009 6-K 1 htm_4430.htm LIVE FILING]