BIDU [Baidu] 6-K: (Original Filing)

[BAIDU, INC. $[●] 4.375% Notes due 2024 to be consolidated and form a single series with the US$600,000,000 4.375% Notes due 2024 issued on November 14, 2018 Underwriting Agreement [●], 2018 Goldman Sachs (Asia) L.L.C. 68/F, Cheung Kong Center 2 Queen’s Road Central Hong Kong J.P. Morgan Securities L]

BIDU [Baidu] 6-K: BAIDU, INC. $[●] 4.375% Notes due 2024 to

[BAIDU, INC. $[●] 4.375% Notes due 2024 to be consolidated and form a single series with the US$600,000,000 4.375% Notes due 2024 issued on November 14, 2018 Underwriting Agreement [●], 2018 Goldman Sachs (Asia) L.L.C. 68/F, Cheung Kong Center 2 Queen’s Road Central Hong Kong J.P. Morgan Securities L]

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