[Hollysys Automation Technologies Announces its Second Sizable Acquisition to Further Establish its Strong Foothold in the International Market Beijing, China – March 7, 2013 – Hollysys Automation Technologies, Ltd. (NASDAQ: HOLI) Bond Corporation Pte. Ltd. is a holding company registered in Singapore, with the subsidiaries Bond M&E Pte. Ltd. incorporated in Singapore in 1979, and Bond M&E Sdn. Bhd. and]