[FORM 20-F o OR x OR o OR o Semiconductor Manufacturing International Corporation Not Applicable Cayman Islands (Jurisdiction of incorporation or organization) 18 Zhangjiang Road, Pudong New Area, Shanghai, China 201203 Mr. Gao Yonggang, Chief Financial Officer Telephone: (8621) 3861-0000 Facsimile: (8621) 3895-3568 18 Zhangjiang Road, Pudong New Area, Shanghai, China 201203 (Name, Telephone, E-mail and/or Facsimile number and Address] [Summary of Longterm Loan Agreement dated June 26, 2013, between Semiconductor Manufacturing International (Beijing) Corporation, Semiconductor Manufacturing International (Tianjin) Corporation, as guarantor, and The Export-Import Bank of China On June 26, 2013, Semiconductor Manufacturing International (Beijing) Corporation (“SMIC Beijing”) entered into twenty-six-month loan agreement with an aggregate principal amount of US$60 million with the Export-Import Bank of China. The draw-down] [Summary of Syndicate Loan Agreement dated August 7, 2013, between Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International Corporation, as guarantor, and Bank of China, The Export-Import Bank of China, China Development Bank, China Construction Bank and Bank of Shanghai. On August 7, 2013, Semiconductor Manufacturing International (Shanghai) Corporation (“SMIC Shanghai”) entered into a seven-year loan agreement with an aggregate] [EXECUTION VERSION Dated 24 October 2013 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DEUTSCHE BANK AG, HONG KONG BRANCH and J.P. MORGAN SECURITIES PLC SUBSCRIPTION AGREEMENT relating to US$200,000,000 Zero Coupon Convertible Bonds due 2018 convertible into ordinary shares of Semiconductor Manufacturing International Corporation 10th Floor, Alexandra House Hong Kong Telephone (852) 2842 4888 Facsimile (852) 2810 8133/2810 1695 Ref: L-215340 Table] [English language summary of Chinese language Joint Venture Agreement dated June 3, 2013, among SMIC Beijing, SMIC, ZDG and BIDIMC Semiconductor Manufacturing International (Beijing) Corporation Semiconductor Manufacturing International Corporation (SMIC) Zhongguancun Development Group Co., Ltd. Beijing Industrial Developing Investment Management Co., Ltd. On Incorporation of Semiconductor Manufacturing North China (Beijing) Corporation Joint Venture Contract THIS DOCUMENT IS SUBJECT TO THE] [CERTIFICATIONS I, Tzu-Yin Chiu, certify that: 1. I have reviewed this annual report on Form 20-F of Semiconductor Manufacturing International Corporation; 2. Based on my knowledge, this report does not contain any untrue statement of a material fact or omit to state a material fact necessary to make the statements made, in light of the circumstances under which such statements] [CERTIFICATION I, Gao Yonggang, certify that: I have reviewed this annual report on Form 20-F of Semiconductor Manufacturing International Corporation; 1. Based on my knowledge, this report does not contain any untrue statement of a material fact or omit to state a material fact necessary to make the statements made, in light of the circumstances under which such statements were] [EX-13.1 8 a14-10249_1ex13d1.htm EX-13.1] [CONSENT OF INDEPENDENT REGISTERED PUBLIC ACCOUNTING FIRM We consent to the incorporation by reference in Registration Statement Nos. 333-193189, 333-170770 and 333-113797 on Form S-8 of our reports dated March 12, 2014, relating to the financial statements and financial statement schedule of Semiconductor Manufacturing International Corporation, and the effectiveness of Semiconductor Manufacturing International Corporation’s internal control over financial reporting, appearing]