Ticker: SMI, Company: SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP, Type: 6-K, Date: 2014-09-29
Original SEC Filing: Click here

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Webplus: SMI/20140929/6-K/2_EX-99.1/000.htm SEC Original: exhibit1.htm
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION PROPOSED ISSUE OF US$500 MILLION 4.125% BONDS DUE 2019 Joint Lead Managers PROPOSED ISSUE OF BONDS Completion of the Bond Subscription Agreement is subject to the satisfaction or waiver of the conditions precedent therein and is expected to take place on 7 October 2014. In addition, the Bond Subscription Agreement may be terminated in certain circumstances.

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Webplus: SMI/20140929/6-K/1/000.htm SEC Original: htm_8885.htm
FORM 6-K Semiconductor Manufacturing International Corporation ——————————————————————————————————— 18 Zhangjiang Road ——————————————————————————————————— x x n/a Semiconductor Manufacturing International Corporation Dr. Tzu-Yin Chiu Dr. Tzu-Yin Chiu Chief Executive Officer and Executive Director Description 99.1 Announcement dated 25 September 2014 “PROPOSED ISSUE OF US$500 MILLION 4.125% BONDS DUE 2019″ 6-K 1 htm_8885.htm LIVE FILING

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Company Information:

Ticker: SMI, Company: SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP, Type: 6-K, Date: 2014-09-29CIK: 0001267482, Location: F4, SIC: 3674, SIC Desc: SEMICONDUCTORS & RELATED DEVICES
Business Phone & Address:
18 ZHANG JIANG ROAD
SHANGHAI